NSN 3439-00-052-3172
Solder Wiping PadDemil:
NO Shelf Life:
N/A UOM:
-- NIIN:
000523172 Pricing & Availability Check
Submit this form for stock availability and pricing.Product Definition Definition of approved item name (AIN): "PAD,SOLDER WIPING"
An item which is specifically intended for use in removing excess flux and solder residue from soldered joints and the working surface of a soldering tool tip. It contains no acid.
3439-00-052-3172 Spec. NSN part characteristics
MRC:
FEAT
Special Features
Cotton ticking and asbestos paper; tallow and soapstone dressing on wipe sur; o/a 2.5 in.Ea lg w, thk per specification mil-c-13194; curved shape;
MRC:
ZZZW
Departure From Cited Document
Mil-c-13194 as mod by o/a dim.
Identification Item Identification Guide (IIG) and Item Name Code (INC)
INC:
12796 FIIG:
A06900 Concept No.:
App. Key:
BJ Cond. Code:
1 Status:
A Special material and handling
HMIC:
P PMIC:
U ESD:
ESD:
ADPE:
CRITL:
X
Hazmat (HMIC) P
Indicates there is no information in the hmirs. The nsn is in a fsc in table ii of fed std 313 and a msds may be required by the user. The requirement for a msds is dependent on a hazard determination of the supplier or the intended end use of item.
Precious Metals (PMIC) U
Precious metal content is unknown
Criticality X
The item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application.