Model: SMP-2002
Desoldering Suction Device TipSpecial Features:
Tip, large chip
Properties:
An item designed to be attached to the end of a suction device, desoldering for the purpose of removing solder during desoldering operation.
Part SMP-2002 NSN 3439-01-353-4374
Material Classification
Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicatorsPackaging & Shipping
Freight Classification
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Schedule B and Export
- Schedule B: 8468201000
- SITC: 73742
- End Use: Photo, service industry machinery
- NAICS: 333992
- USDA: 1
Freight Class: Gas-operated machinery and apparatus for soldering, brazing, welding or surface tempering, hand-directed or controlled
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