Model: MBD-X6DH8-XB-O
Backplane AssemblySpecial Features:
Dual intel 64-bit xeon support up to 3.80 ghz, 800 mhz fsb; intel e7520 (lindenhurst) chipset; up to 16gb ddr 333 sdram (or) up to 32gb ddr 266 sdram; dual broadcom bcm5721 gigabit ethernet controller; adaptec aic-7902 dual channel ultra320 scsi; 2x sata ports via ich5r sata controller; 1 (x4) pci-express, 2x 64-bit 133/100mhz pci-x, 4x 64-bit 100mhz pci-x; zero-channel raid
Properties:
An insulating panel upon which two or more connector, receptacle, electrical, are mounted, and completely processed electrical conductor paths are deposited, etched, or printed in various paths. it provides or completes a circuit between two or more circuit card assembly or electronic components assembly. it may be designed for panel or chassis mounting, or for insertion into a connector, receptacle, electrical. includes motherboards. for items containing processed electrical conductor paths and contacts for plug-in connecting facilities, see printed wiring board. see also printed circuit board; circuit card assembly and cable assembly, printed, flexible.
Part MBD-X6DH8-XB-O NSN 5998-01-579-0267
Material Classification
Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicatorsPackaging & Shipping
Freight Classification
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Schedule B and Export
- Schedule B: 8542900000
- SITC: 77689
- End Use: Semiconductors
- NAICS: 334413
- USDA: 1
Freight Class: Electronic integrated circuits and microassembly parts
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