Model: LO4304

Unitized Semiconductor Devices

Special Features:

Item must comply with requirements of defense supply center columbus production standard lo4304

Properties:

Inclosure Material
Glass
Overall Length
0.795 inches
Terminal Length
0.700 inches
Overall Height
0.255 inches
Overall Width
0.540 inches
Mounting Facility Quantity
1
Joint Electronic Device Engineering Council/jedec/case Outline Designation
To-254
Component Name And Quantity
2 semiconductor device diode
Mounting Method
Terminal and unthreaded hole
Features Provided
Hermetically sealed case
Criticality Code Justification
Zzzy
Semiconductor Material
Silicon all semiconductor device diode
Voltage Rating In Volts Per Characteristic
45.0 working peak reverse voltage all semiconductor device diode
Current Rating Per Characteristic
30.00 amperes forward current, average absolute all semiconductor device diode and 25.00 amperes source cutoff current preset all semiconductor device diode
Maximum Operating Tempurature Per Measurement Point
150.0 degrees celsius ambient air
Terminal Type And Quantity
3 uninsulated wire lead
Reference Number Differentiating Characteristics
Breference number differentiating material will be in accordance with naval inventory control point activity hx quality control. Manufacturing and testing specifications available at the dla icp.
NSN
5961-01-322-9505
Part Number
LO4304
Description
Semiconductor Devices,unitized
CAGE

Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see rectifier, semiconductor device. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see microcircuit (as modified). Excludes network (as modified); absorber, overvoltage; semiconductor device set; and semiconductor device assembly. Do not use if more specific name applies.

Part LO4304 NSN 5961-01-322-9505

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
61962
FIIG:
A110A0
Concept No.:
App. Key:
E
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
A
ESD:
A
MMAC:
CRITL:
S

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
0.1000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
063025
UFC:
34525
LTL:
RATING VARIABLE
LCL:
--
WCC:
72D
TCC:
Z
SHC:
9
ACC:
Instruments/Radio

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Schedule B and Export
  • Schedule B: 8541500080
  • SITC: 77639
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Semiconductor devices, nesoi

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