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- FSC 5350 | Abrasive Materials
- HYPREZ OS DIAMOND COMPOUND
Model: HYPREZ OS DIAMOND COMPOUND
Lapping And Grinding CompoundProperties:
An abrasive grain in a suitable liquid or semiliquid carrier, sometimes known as vehicle or binder, intended for use in hand or machine removal of small quantities of material to close tolerances.
Part HYPREZ OS DIAMOND COMPOUND NSN 5350-00-276-5858
Material Classification
Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicatorsFreight Classification
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Schedule B and Export
- Schedule B: 2513209000
- SITC: 27722
- End Use: Other industrial supplies
- NAICS: 327910
- USDA: 1
Freight Class: Emery, natural corundum, natural garnet & other natural abrasives, whether or not heat-treated, nesoi
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