Model: FE3D
Diode Semiconductor DeviceSpecial Features:
3.0 amperes forward current; high temperature metallurgically bonded construction; glass passivated cavity-free junction; superfast recovery time for high efficiency; low forward forward voltage, high current capability; low leakage current; high surge current capability; high temperature soldering guaranteed; case-solid glass body; terminals-plated axial leads; polarity-color band denotes cathode end; mounting position-any; weight-0.037 ounce
Properties:
A two electrode semiconductor device having an asymmetrical voltage - current characteristic. May or may not include mounting hardware and/or heatsink. Excludes light emitting diode and semiconductor device,photo. For items containing material such as selenium and copper oxide, see recifier, metallic.
Part FE3D NSN 5961-01-625-9167
Material Classification
Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicatorsPricing & Availability Check
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Schedule B and Export
- Schedule B: 8541100070
- SITC: 77631
- End Use: Semiconductors
- NAICS: 334413
- USDA: 1
Freight Class: Diodes, other than photosensitve or led, with a maximum current of 0.5 a or less
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