Model: DG125AP

Linear Microcircuit

Properties:

Body Length
Between 0.690 inches and 0.830 inches
Body Width
Between 0.275 inches and 0.310 inches
Body Height
Between 0.050 inches and 0.180 inches
Maximum Power Dissipation Rating
1200.0 milliwatts
Operating Tempurature Range
-55.0/+125.0 degrees celsius
Storage Tempurature Range
-65.0/+150.0 degrees celsius
Features Provided
Hermetically sealed and monolithic and negative outputs and positive outputs
Inclosure Material
Ceramic and metal
Inclosure Configuration
Dual-in-line
Design Function And Quantity
5 driver, switch, field effect transistor and 5 switch, analog
Terminal Surface Treatment
Gold
Voltage Rating And Type Per Characteristic
15.0 volts power source
Time Rating Per Chacteristic
2000.00 nanoseconds propagation delay time, low to high level output and 300.00 nanoseconds propagation delay time, high to low level output
Precious Material And Location
Terminal surface gold
Precious Material
Gold
Test Data Document
96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).
Terminal Type And Quantity
14 printed circuit
NSN
5962-00-318-2401
Part Number
DG125AP
Description
Microcircuit,linear
CAGE

A microcircuit whose output is a function of the input; that is, the output varies in a predetermined and essentially predictable manner from the input signal.

Part DG125AP NSN 5962-00-318-2401

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
31778
FIIG:
A458A0
Concept No.:
1
App. Key:
B
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
G
ESD:
B
ESD:
B
MMAC:
CRITL:
X

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
061700
UFC:
34580
LTL:
RATING VARIABLE
LCL:
--
WCC:
72D
TCC:
3
SHC:
9
ACC:
Instruments/Radio

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Schedule B and Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Electronic integrated circuits and microassembly parts

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