Model: CHIPBONDER 368

Adhesive

Properties:

Physical Form
Paste
Quantity Within Each Unit Package
10.000 milliliters
Specific Usage Design
For bonding surface mounted devices (smds) to printed circuit boards
Features Provided
Heat vulcanize feature
Rated Drying Time
13.000 minutes
Color
Red
Material
Plastic epoxy
Supplementary Features
10 milliliter syringe
NSN
8040-01-417-5043
Part Number
CHIPBONDER 368
Description
Adhesive
CAGE
05972

Part CHIPBONDER 368 NSN 8040-01-417-5043

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
11297
FIIG:
A535P0
Concept No.:
App. Key:
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
Y
PMIC:
A
ESD:
ESD:
MMAC:
CRITL:
X

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