Model: BOXD946GZISSL

Backplane Assembly

Special Features:

Memory two 240-pin ddr2 sdram dual inline memory module (dimm) sockets; support for ddr2 667 or ddr2 533 mhz dimms; support for up to 4 gb of systemmemory; usb supports 2.0 devices; lan support, 10/100 mbits/sec lan subsystem using the intel 82562g platform lan connect (plc) device; supports for up to 4 gb of system memory; audio, 6-channel (5.1) audio subsystem using the sigma tel stac9227 audio codec;

Properties:

Overall Length
9.600 inches
Overall Width
9.600 inches
Features Provided
Thermal overload protection
Part Name Assigned By Controlling Agency
Intel desktop board d946gzis
Functional Description
Used to support the visually stunning windows aero user interface with transition effects and realistic animations
NSN
5998-01-560-6762
Part Number
BOXD946GZISSL
Description
Backplane Assembly
CAGE

An insulating panel upon which two or more connector, receptacle, electrical, are mounted, and completely processed electrical conductor paths are deposited, etched, or printed in various paths. it provides or completes a circuit between two or more circuit card assembly or electronic components assembly. it may be designed for panel or chassis mounting, or for insertion into a connector, receptacle, electrical. includes motherboards. for items containing processed electrical conductor paths and contacts for plug-in connecting facilities, see printed wiring board. see also printed circuit board; circuit card assembly and cable assembly, printed, flexible.

Part BOXD946GZISSL NSN 5998-01-560-6762

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
34736
FIIG:
A511K0
Concept No.:
App. Key:
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
A
ESD:
A
MMAC:
CRITL:
X

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Schedule B and Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Electronic integrated circuits and microassembly parts

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