Model: BAYSTACK 660
Circuit Card AssemblySpecial Features:
460 ma peak, 290 ma typical, 90 ma powersave; network interface wireless integrated antenna; operating temperature: 0 to 55 degrees centigrade; storage temperature: -20 to 65 degrees centigrade; 95 percent noncondensing humidity; 128 kb sram; software drivers: odi, ndis 2, and ndis 3 drivers for dos; supports most card and socket services including ibm, phoenix, and systemsoft
Properties:
A grouping of two or more physically connected or related electrical an/or electronic parts capable of dissassemblage. each component of the assemblage must be capable of functioning in accordance with its own item name. consists of a single printed circuit board or terminal board upon which are mounted separately manufactured electronic components such as capacitors, inductors, resistors, and the like. it may also include printed electronic components. the item is generally part of a subassembly and cannot be assigned a more definite item name. for items having a complete individual electrical/electronic function, use applicable item name such as amplifier (as modified); power supply; or the like. for items not having a complete individual electrical/electronic function, see applicable subassembly name, such as amplifier subassembly; power supply subassembly; or the like. for an assembly of electrical/electronic components mounted on other than a single printed wiring board, see electronic components assembly. excludes printed circuit boar
Part BAYSTACK 660 NSN 5998-01-468-4773
Material Classification
Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicatorsPricing & Availability Check
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Schedule B and Export
- Schedule B: 8542900000
- SITC: 77689
- End Use: Semiconductors
- NAICS: 334413
- USDA: 1
Freight Class: Electronic integrated circuits and microassembly parts
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