Model: 5413 3/8 IN.
Pressure Sensitive Adhesive TapeSpecial Features:
Used as mask for protection of gold fingers of printed circuit boards during wave solder or solder dip process, release surface in fabrication of parts cured at elevated temperatures; rohs compliant
Properties:
Part 5413 3/8 IN. NSN 7510-01-470-9469
Material Classification
Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicatorsFreight Classification
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