Model: 1D8977

Backplane Assembly

Properties:

End Application
F 16 blanker
Part Name Assigned By Controlling Agency
Circuit card assembly, motherboard a10
Precious Material And Location
0location not supplied gold
NSN
5998-01-312-6074
Part Number
1D8977
Description
Backplane Assembly
CAGE
97953

An insulating panel upon which two or more connector, receptacle, electrical, are mounted, and completely processed electrical conductor paths are deposited, etched, or printed in various paths. it provides or completes a circuit between two or more circuit card assembly or electronic components assembly. it may be designed for panel or chassis mounting, or for insertion into a connector, receptacle, electrical. includes motherboards. for items containing processed electrical conductor paths and contacts for plug-in connecting facilities, see printed wiring board. see also printed circuit board; circuit card assembly and cable assembly, printed, flexible.

Part 1D8977 NSN 5998-01-312-6074

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
34736
FIIG:
A511K0
Concept No.:
App. Key:
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
G
ESD:
A
ESD:
A
MMAC:
EW
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
12.3 X 8.3 X 4.0
Paclk Weight:
1.1000lbs
Item Weight:
0.3000lbs
Item Dim:
008000700023
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
F000002XC6
SPI Rev.:
SPC Mkg:
17
LVL_A:
LVL_B:

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
061700
UFC:
34580
LTL:
RATING VARIABLE
LCL:
85.0
WCC:
72D
TCC:
Z
SHC:
Z
ACC:
Instruments/Radio

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New Products Recently updated in associated hardware cards boards electrical and electronic assemblies

Schedule B and Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Electronic integrated circuits and microassembly parts

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