Model: 10272557

Unitized Semiconductor Devices

Special Features:

All transistor junction pattern arrangement: npn

Properties:

Inclosure Material
Ceramic
Overall Length
Between 0.240 inches and 0.290 inches
Terminal Length
0.070 inches
Overall Height
Between 0.030 inches and 0.070 inches
Overall Width
Between 0.120 inches and 0.175 inches
Component Name And Quantity
2 transistor
Mounting Method
Press fit
Features Provided
Hermetically sealed case
Semiconductor Material
Silicon all transistor
Voltage Rating In Volts Per Characteristic
30.0 breakdown voltage, collector-to-base, emitter open all transistor and 3.0 breakdown voltage, emitter-to-base, collector open all transistor
Current Rating Per Characteristic
50.00 milliamperes source cutoff current all transistor
Power Rating Per Characteristic
470.0 milliwatts small-signal input power, common-collector preset all transistor
Maximum Operating Tempurature Per Measurement Point
200.0 degrees celsius ambient air
Test Data Document
18876-10272557 drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing)
Terminal Type And Quantity
6 pin
NSN
5961-01-225-3334
Part Number
10272557
Description
Semiconductor Devices,unitized
CAGE
07933

Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see rectifier, semiconductor device. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see microcircuit (as modified). Excludes network (as modified); absorber, overvoltage; semiconductor device set; and semiconductor device assembly. Do not use if more specific name applies.

Part 10272557 NSN 5961-01-225-3334

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
61962
FIIG:
A110A0
Concept No.:
App. Key:
E
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
ESD:
MMAC:
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
--
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
060500
UFC:
81820
LTL:
NO RATING
LCL:
--
WCC:
72D
TCC:
Z
SHC:
9
ACC:
Instruments/Radio

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Schedule B and Export
  • Schedule B: 8541500080
  • SITC: 77639
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Semiconductor devices, nesoi

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