Model: B2166-2040G1

Semiconductor Device Assembly
Description:

Semiconductor Device Assembly.

Properties:

NSN
5980-00-087-9267
Part Number
B2166-2040G1
Description
Semiconductor Device Assembly
CAGE
06900

A grouping of two or more semiconducting devices such as light emitting diode; semiconductor device, diode; semiconductor device, photo; semiconductor device, thyristor; and/or transistor mounted on a common mounting or mounted on each other. The devices must be separable and each item must be capable of functioning in accordance with its given name. For assemblies consisting of semiconducting devices permanently cased, encapsulated, or potted together to form a single unit, see rectifier, semiconductor device, unitized and semiconductor devices, unitized. Excludes semiconductor device set; microcircuit assembly; and microcircuit set. See also absorber, overvoltage.

Part B2166-2040G1 NSN 5980-00-087-9267

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
35565
FIIG:
T01200
Concept No.:
App. Key:
C
Cond. Code:
2
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
A
ESD:
A
MMAC:
CRITL:

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
2.0 X 2.0 X 1.3
Paclk Weight:
1.0000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
SPI No.:
SPI Rev.:
SPC Mkg:
LVL_A:
LVL_B:

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
116250
UFC:
59490
LTL:
100.0
LCL:
100.0
WCC:
734
TCC:
Z
SHC:
9
ACC:
Office Supplies

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New Products Recently updated in optoelectronic devices and associated hardware

Schedule B and Export
  • Schedule B: 9001907000
  • SITC: 88419
  • End Use: Cell phones and other household goods, n.e.c.
  • NAICS: 333314
  • USDA: 1

Freight Class: Other optical elements of any material, unmounted, other than such element of glass not optically worked, nesoi

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