Model: 304-0193-001

Semiconductor Device Set

Properties:

Inclosure Material
Metal all transistor
Overall Length
0.240 inches all transistor and 0.260 inches all transistor
Terminal Length
0.500 inches all transistor
Overall Diameter
0.350 inches all transistor and 0.370 inches all transistor
Internal Configuration
Junction contact all transistor
Joint Electronic Device Engineering Council/jedec/case Outline Designation
To-39 all transistor
Internal Junction Configuration
Npn 1st transistor
Internal Junction Configuration
Pnp 2nd transistor
Component Function Relationship
Matched
Component Name And Quantity
2 transistor
Mounting Method
Terminal all transistor
Semiconductor Material
Silicon all transistor
Voltage Rating In Volts Per Characteristic
30.0 collector to emitter voltage/static/base open 1st transistor and 3.5 emitter to base voltage, dc 1st transistor
Voltage Rating In Volts Per Characteristic
20.0 collector to emitter voltage/static/base open 2nd transistor and 4.0 emitter to base voltage, dc 2nd transistor
Voltage Rating In Volts Per Characteristic
40.0 collector to base voltage, dc all transistor
Current Rating Per Characteristic
0.40 amperes source cutoff current all transistor
Current Rating Per Characteristic
0.40 amperes collector current, dc all transistor
Power Rating Per Characteristic
3.5 watts small-signal input power, common-collector absolute 1st transistor
Power Rating Per Characteristic
5.0 watts small-signal input power, common-collector absolute 2nd transistor
Power Rating Per Characteristic
5.0 watts total device dissipation 2nd transistor
Maximum Operating Tempurature Per Measurement Point
200.0 degrees celsius junction all transistor
Terminal Type And Quantity
3 uninsulated wire lead all transistor
NSN
5961-00-107-6178
Part Number
304-0193-001
Description
Semiconductor Device Set
CAGE

A grouping of two or more individual semiconductor devices, such as transistors, diodes, and photo semiconductor devices. It includes matched pairs. Excludes absorber, overvoltage; semiconductor device assembly. For interconnected items functioning as power supply rectifiers, see rectifier, semiconductor device.

Part 304-0193-001 NSN 5961-00-107-6178

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
20590
FIIG:
A110A0
Concept No.:
App. Key:
F
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
ESD:
MMAC:
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
0.1000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
O
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
063025
UFC:
34525
LTL:
RATING VARIABLE
LCL:
--
WCC:
658
TCC:
Z
SHC:
9
ACC:
Instruments/Radio

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Schedule B and Export
  • Schedule B: 8541500080
  • SITC: 77639
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Semiconductor devices, nesoi

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