NSN 3439-01-106-3741
Solder Wiping PadDemil:
NO Shelf Life:
N/A UOM:
-- NIIN:
011063741 Pricing & Availability Check
Submit this form for stock availability and pricing.Cross Reference Parts Part numbers that meet the specification outlined on this page and set by the OEM
Indicates a design/source control reference item
Inidicates part number has been superseded
Definition Definition of approved item name (AIN): "PAD,SOLDER WIPING"
An item which is specifically intended for use in removing excess flux and solder residue from soldered joints and the working surface of a soldering tool tip. It contains no acid.
Identification Item Identification Guide (IIG) and Item Name Code (INC)
INC:
12796 FIIG:
A06900 Concept No.:
App. Key:
BJ Cond. Code:
1 Status:
A Special material and handling
HMIC:
P PMIC:
U ESD:
ESD:
ADPE:
CRITL:
Hazmat (HMIC) P
Indicates there is no information in the hmirs. The nsn is in a fsc in table ii of fed std 313 and a msds may be required by the user. The requirement for a msds is dependent on a hazard determination of the supplier or the intended end use of item.
Precious Metals (PMIC) U
Precious metal content is unknown