Model: UXAN1N21WEMR

Semiconductor Device Set
Description:

Ceramic all semiconductor device diode inclosure material, 0.800 inches all semiconductor device diode overall length, 0.222 inches all semiconductor device diode overall diameter.

Properties:

Inclosure Material
Ceramic all semiconductor device diode
Overall Length
0.800 inches all semiconductor device diode and 0.840 inches all semiconductor device diode
Overall Diameter
0.222 inches all semiconductor device diode and 0.240 inches all semiconductor device diode
Function For Which Designed
Mixer
Component Function Relationship
Matched
Component Name And Quantity
2 semiconductor device diode
Mounting Method
Press fit all semiconductor device diode
Features Provided
Gold plated leads
Semiconductor Material
Silicon all semiconductor device diode
Maximum Operating Tempurature Per Measurement Point
150.0 degrees celsius ambient air all semiconductor device diode
Precious Material And Location
Terminal surfaces gold
Precious Material
Gold
Test Data Document
81349-mil-s-19500 specification (includes engineering type bulletins, brochures, etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type data on certain environmental and performance requirements and test conditions that are shown as "typical", "average", "", etc.).
Terminal Type And Quantity
2 pin all semiconductor device diode
Specification Data
81349-mil-s-19500/232 government specification
NSN
5961-00-079-4041
Part Number
UXAN1N21WEMR
Description
Semiconductor Device Set
CAGE
3BBY6

A grouping of two or more individual semiconductor devices, such as transistors, diodes, and photo semiconductor devices. It includes matched pairs. Excludes absorber, overvoltage; semiconductor device assembly. For interconnected items functioning as power supply rectifiers, see rectifier, semiconductor device.

Part UXAN1N21WEMR NSN 5961-00-079-4041

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
20590
FIIG:
A110A0
Concept No.:
App. Key:
F
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
G
ESD:
B
ESD:
B
MMAC:
EH
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
2.0000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
063025
UFC:
34525
LTL:
RATING VARIABLE
LCL:
--
WCC:
658
TCC:
3
SHC:
9
ACC:
Instruments/Radio

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Schedule B and Export
  • Schedule B: 8541500080
  • SITC: 77639
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Semiconductor devices, nesoi

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