Model: TUSL2-C
Backplane AssemblySpecial Features:
Processor- socket 370 for intel tualatin/pentium iii 533mhz- 1.2 ghz+ processor and intel celeron 533-850mhz+; chipset intel 815ep (bo stepping); intel 82801 ba enhanced i/o controller hub 2 (ich2) supports pc 133/pc100 sdram, ultradma/100, 4x agp
Properties:
An insulating panel upon which two or more connector, receptacle, electrical, are mounted, and completely processed electrical conductor paths are deposited, etched, or printed in various paths. it provides or completes a circuit between two or more circuit card assembly or electronic components assembly. it may be designed for panel or chassis mounting, or for insertion into a connector, receptacle, electrical. includes motherboards. for items containing processed electrical conductor paths and contacts for plug-in connecting facilities, see printed wiring board. see also printed circuit board; circuit card assembly and cable assembly, printed, flexible.
Part TUSL2-C NSN 5998-01-579-3684
Material Classification
Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicatorsPackaging & Shipping
Freight Classification
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Schedule B and Export
- Schedule B: 8542900000
- SITC: 77689
- End Use: Semiconductors
- NAICS: 334413
- USDA: 1
Freight Class: Electronic integrated circuits and microassembly parts
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