Model: SYS68K/DRAM-1

Backplane Assembly

Properties:

End Application
C5 mr1505 module t/s
NSN
5998-01-275-8523
Part Number
SYS68K/DRAM-1
Description
Backplane Assembly
CAGE
68693

An insulating panel upon which two or more connector, receptacle, electrical, are mounted, and completely processed electrical conductor paths are deposited, etched, or printed in various paths. it provides or completes a circuit between two or more circuit card assembly or electronic components assembly. it may be designed for panel or chassis mounting, or for insertion into a connector, receptacle, electrical. includes motherboards. for items containing processed electrical conductor paths and contacts for plug-in connecting facilities, see printed wiring board. see also printed circuit board; circuit card assembly and cable assembly, printed, flexible.

Part SYS68K/DRAM-1 NSN 5998-01-275-8523

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
34736
FIIG:
A511K0
Concept No.:
App. Key:
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
A
ESD:
A
MMAC:
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
13.5 X 13.5 X 4.0
Paclk Weight:
3.5000lbs
Item Weight:
1.0000lbs
Item Dim:
011000800010
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
F000009XD1
SPI Rev.:
SPC Mkg:
39
LVL_A:
LVL_B:

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Schedule B and Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Electronic integrated circuits and microassembly parts

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