Model: SP3467QF

Unitized Semiconductor Devices

Special Features:

All transistor junction pattern arrangement: pnp

Properties:

Inclosure Material
Metal or ceramic
Overall Length
0.390 inches
Overall Height
0.080 inches
Overall Width
0.310 inches
Joint Electronic Device Engineering Council/jedec/case Outline Designation
To-86
Component Name And Quantity
4 transistor
Mounting Method
Terminal
Features Provided
Hermetically sealed case
Semiconductor Material
Silicon all transistor
Voltage Rating In Volts Per Characteristic
40.0 collector to base voltage, dc all transistor and 40.0 collector to emitter voltage/static/base open all transistor and 5.0 emitter to base voltage, dc all transistor
Current Rating Per Characteristic
1.00 amperes source cutoff current all transistor
Power Rating Per Characteristic
5.0 watts small-signal input power, common-collector absolute all transistor
Maximum Operating Tempurature Per Measurement Point
200.0 degrees celsius junction
Test Data Document
17981-012043 drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing)
Terminal Type And Quantity
14 uninsulated wire lead
NSN
5961-01-117-1795
Part Number
SP3467QF
Description
Semiconductor Devices,unitized
CAGE
10239

Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see rectifier, semiconductor device. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see microcircuit (as modified). Excludes network (as modified); absorber, overvoltage; semiconductor device set; and semiconductor device assembly. Do not use if more specific name applies.

Part SP3467QF NSN 5961-01-117-1795

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
61962
FIIG:
A110A0
Concept No.:
App. Key:
E
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
B
ESD:
B
MMAC:
EH
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
0.1000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
O
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
063025
UFC:
34525
LTL:
RATING VARIABLE
LCL:
--
WCC:
72D
TCC:
3
SHC:
9
ACC:
Instruments/Radio

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Schedule B and Export
  • Schedule B: 8541500080
  • SITC: 77639
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Semiconductor devices, nesoi

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