Special Features:

Material glass epoxy sheet type flgfn062c1/1a1a per mil-p-13949; finish tin-lead plate and reflow per mil-std-275; etch pattern on board per master pattern mp-18298; o/a lg in.Nom 4.625; o/a w in.Nom 2.000;

Properties:

An insulating panel upon which completely processed electrical conductor paths are deposited, etched, or printed in various patterns to provide or complete a circuit between two or more points. It may provide contacts for plug-in connecting facilities. It may be designed for panel or chassis mounting, or for insertion into a connector, receptacle, electrical. For items containing printed electronic components, see printed circuit board. For items containing separately manufactured electronic components, see circuit card assembly. For items consisting only of electrical conductor paths and two or more connectors, see backplane assembly.