Model: SKKT26 12

Unitized Semiconductor Devices

Properties:

Inclosure Material
Plastic
Overall Length
3.620 inches
Overall Height
0.787 inches
Overall Width
1.417 inches
Mounting Facility Quantity
2
Component Name And Quantity
2 semiconductor device thyristor
Mounting Method
Unthreaded hole
Semiconductor Material
Silicon all semiconductor device diode
Voltage Rating In Volts Per Characteristic
1300.0 nonrepetitive peak reverse voltage all semiconductor device thyristor and 1200.0 repetitive peak reverse voltage all semiconductor device thyristor and 1200.0 repetitive peak off-state voltage all semiconductor device thyristor
Current Rating Per Characteristic
50.00 amperes forward current, total rms torr all semiconductor device thyristor and 25.00 amperes forward current, total rms universal all semiconductor device thyristor and 300.00 amperes peak forward surge current absolute all semiconductor device thyristor
Power Rating Per Characteristic
10.0 watts small-signal input power, common-collector blank all semiconductor device thyristor and 0.5 watts small-signal input power, common-collector universal all semiconductor device thyristor
Maximum Operating Tempurature Per Measurement Point
125.0 degrees celsius ambient air
Test Data Document
10110-140195 drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing)
Terminal Type And Quantity
3 screw
NSN
5961-01-128-4825
Part Number
SKKT26 12
Description
Semiconductor Devices,unitized
CAGE
R1221

Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see rectifier, semiconductor device. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see microcircuit (as modified). Excludes network (as modified); absorber, overvoltage; semiconductor device set; and semiconductor device assembly. Do not use if more specific name applies.

Part SKKT26 12 NSN 5961-01-128-4825

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
61962
FIIG:
A110A0
Concept No.:
App. Key:
E
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
B
ESD:
B
MMAC:
EH
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
0.5000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
O
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
062900
UFC:
35110
LTL:
85.0
LCL:
--
WCC:
658
TCC:
3
SHC:
9
ACC:
Instruments/Radio

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Schedule B and Export
  • Schedule B: 8541500080
  • SITC: 77639
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Semiconductor devices, nesoi

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