Model: S572009
Solder Wiping PadProperties:
An item which is specifically intended for use in removing excess flux and solder residue from soldered joints and the working surface of a soldering tool tip. It contains no acid.
Part S572009 NSN 3439-00-768-8915
Material Classification
Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicatorsPackaging & Shipping
Freight Classification
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Schedule B and Export
- Schedule B: 8468901000
- SITC: 73749
- End Use: Photo, service industry machinery
- NAICS: 333992
- USDA: 1
Freight Class: Parts of hand-directed or controlled machinery and apparatus for soldering, brazing, welding or surface tempering, other than those of heading 8515
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