Model: ROM/PROM HEAD 186

Memory Microcircuit

Properties:

Body Length
0.840 inches
Body Width
Between 0.220 inches and 0.310 inches
Body Height
0.185 inches
Maximum Power Dissipation Rating
633.0 milliwatts
Operating Tempurature Range
-55.0/+125.0 degrees celsius
Storage Tempurature Range
-65.0/+150.0 degrees celsius
Features Provided
Hermetically sealed and burn in and 3-state output and programmable and monolithic
Inclosure Material
Ceramic
Inclosure Configuration
Dual-in-line
Output Logic Form
Complementary-metal oxide-semiconductor logic
Input Circuit Pattern
6 input
Case Outline Source And Designator
D-2 mil-m-38510
Current Rating Per Characteristic
30.00 milliamperes supply
Terminal Surface Treatment
Solder
Voltage Rating And Type Per Characteristic
-0.5 volts power source and 7.0 volts power source
Time Rating Per Chacteristic
50.00 nanoseconds propagation delay time, low to high level output and 50.00 nanoseconds propagation delay time, high to low level output
Memory Device Type
Prom
Memory Capacity
Unknown
Test Data Document
14933-5962-86703 drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing)
Terminal Type And Quantity
16 printed circuit
NSN
5962-01-254-5149
Part Number
ROM/PROM HEAD 186
Description
Microcircuit,memory
CAGE
16236

A circuit designed to store information and/or coded instructions for later use. Item has pins or other connections to install in a computer or computing device. does not include magnetic drums, tapes, punched cards or the like. for items that have portable type connections see memory, portable, solid state.

Part ROM/PROM HEAD 186 NSN 5962-01-254-5149

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
41015
FIIG:
A458A0
Concept No.:
1
App. Key:
F
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
D
ESD:
D
MMAC:
EH
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
0.1000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
061700
UFC:
34580
LTL:
RATING VARIABLE
LCL:
77.5
WCC:
738
TCC:
Z
SHC:
9
ACC:
Instruments/Radio

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Schedule B and Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Electronic integrated circuits and microassembly parts

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