Model: ROM/PROM HEAD 008

Memory Microcircuit

Properties:

Body Length
0.840 inches
Body Width
Between 0.220 inches and 0.310 inches
Body Height
Between 0.140 inches and 0.185 inches
Maximum Power Dissipation Rating
794.0 milliwatts
Operating Tempurature Range
-55.0/+125.0 degrees celsius
Storage Tempurature Range
-65.0/+150.0 degrees celsius
Features Provided
Hermetically sealed and burn in and programmable and schottky and 3-state output
Inclosure Material
Ceramic
Inclosure Configuration
Dual-in-line
Output Logic Form
Transistor-transistor logic
Input Circuit Pattern
10 input
Case Outline Source And Designator
D-2 mil-m-38510
Terminal Surface Treatment
Solder
Voltage Rating And Type Per Characteristic
-0.5 volts power source and 7.0 volts power source
Time Rating Per Chacteristic
85.00 nanoseconds propagation delay time, low to high level output and 85.00 nanoseconds propagation delay time, high to low level output
Memory Device Type
Prom
Memory Capacity
Unknown
Test Data Document
81349-mil-m-38510 specification (includes engineering type bulletins, brochures, etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type data on certain environmental and performance requirements and test conditions that are shown as "typical", "average", "", etc.).
Terminal Type And Quantity
16 printed circuit
Specification Data
81349-mil-m-38510/204 government specification
NSN
5962-01-262-2185
Part Number
ROM/PROM HEAD 008
Description
Microcircuit,memory
CAGE
16236

A circuit designed to store information and/or coded instructions for later use. Item has pins or other connections to install in a computer or computing device. does not include magnetic drums, tapes, punched cards or the like. for items that have portable type connections see memory, portable, solid state.

Part ROM/PROM HEAD 008 NSN 5962-01-262-2185

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
41015
FIIG:
A458A0
Concept No.:
1
App. Key:
F
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
D
ESD:
D
MMAC:
EH
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
0.1000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
061700
UFC:
34580
LTL:
RATING VARIABLE
LCL:
77.5
WCC:
738
TCC:
Z
SHC:
9
ACC:
Instruments/Radio

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Schedule B and Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Electronic integrated circuits and microassembly parts

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