Model: ROM/PROM FAMILY 008

Memory Microcircuit

Properties:

Body Length
Between 0.750 inches and 0.795 inches
Body Width
Between 0.245 inches and 0.300 inches
Body Height
Between 0.120 inches and 0.195 inches
Maximum Power Dissipation Rating
625.0 milliwatts
Operating Tempurature Range
+0.0/+75.0 degrees celsius
Storage Tempurature Range
-65.0/+150.0 degrees celsius
End Application
Cheyenne aircraft model 427m
Features Provided
Hermetically sealed and high speed and monolithic and positive outputs and programmable and programmed and w/buffered output and w/decoded output and w/disable and w/enable and w/storage and 3-state output
Inclosure Material
Ceramic and glass
Inclosure Configuration
Dual-in-line
Output Logic Form
Transistor-transistor logic
Input Circuit Pattern
10 input
Case Outline Source And Designator
-0-001-ag joint electron device engineering council
Terminal Surface Treatment
Solder
Voltage Rating And Type Per Characteristic
5.5 volts power source
Time Rating Per Chacteristic
30.00 nanoseconds propagation delay time, low to high level output and 30.00 nanoseconds propagation delay time, high to low level output
Memory Device Type
Ram
Memory Capacity
Unknown
Test Data Document
11530-278539 drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing)
Terminal Type And Quantity
16 printed circuit
NSN
5962-01-039-7339
Part Number
ROM/PROM FAMILY 008
Description
Microcircuit,memory
CAGE
16236

A circuit designed to store information and/or coded instructions for later use. Item has pins or other connections to install in a computer or computing device. does not include magnetic drums, tapes, punched cards or the like. for items that have portable type connections see memory, portable, solid state.

Part ROM/PROM FAMILY 008 NSN 5962-01-039-7339

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
41015
FIIG:
A458A0
Concept No.:
1
App. Key:
F
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
U
ESD:
B
ESD:
B
MMAC:
EH
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
0.1000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
061700
UFC:
34580
LTL:
RATING VARIABLE
LCL:
77.5
WCC:
738
TCC:
Z
SHC:
9
ACC:
Instruments/Radio

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Schedule B and Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Electronic integrated circuits and microassembly parts

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