Model: ROM/PROM FAMILY 004

Memory Microcircuit
Description:

0.340 inches body length, 0.265 inches body width, 0.030 inches body height, 625.0 milliwatts maximum power dissipation rating.

Properties:

Body Length
Between 0.340 inches and 0.440 inches
Body Width
Between 0.265 inches and 0.325 inches
Body Height
Between 0.030 inches and 0.075 inches
Maximum Power Dissipation Rating
625.0 milliwatts
Operating Tempurature Range
+0.0/+75.0 degrees celsius
Storage Tempurature Range
-65.0/+150.0 degrees celsius
End Application
58404091248
Features Provided
Hermetically sealed and monolithic and negative outputs and positive outputs and w/enable and programmable and programmed and bipolar and w/buffered output and w/decoded output and expandable and wire-or outputs
Inclosure Material
Ceramic and glass
Inclosure Configuration
Flat pack
Output Logic Form
Transistor-transistor logic
Input Circuit Pattern
6 input
Terminal Surface Treatment
Solder
Voltage Rating And Type Per Characteristic
5.5 volts power source
Time Rating Per Chacteristic
50.00 nanoseconds propagation delay time, low to high level output
Memory Device Type
Rom
Test Data Document
05869-717383 drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing)
Terminal Type And Quantity
16 flat leads
NSN
5962-00-179-2900
Part Number
ROM/PROM FAMILY 004
Description
Microcircuit,memory
CAGE
16236

A circuit designed to store information and/or coded instructions for later use. Item has pins or other connections to install in a computer or computing device. does not include magnetic drums, tapes, punched cards or the like. for items that have portable type connections see memory, portable, solid state.

Part ROM/PROM FAMILY 004 NSN 5962-00-179-2900

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
41015
FIIG:
A458A0
Concept No.:
1
App. Key:
F
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
U
ESD:
B
ESD:
B
MMAC:
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
0.2000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
061700
UFC:
34580
LTL:
RATING VARIABLE
LCL:
77.5
WCC:
738
TCC:
Z
SHC:
9
ACC:
Instruments/Radio

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Schedule B and Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Electronic integrated circuits and microassembly parts

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