Model: ROM/PROM

Memory Microcircuit

Properties:

Maximum Power Dissipation Rating
1.04 watts
Operating Tempurature Range
-55.0/+125.0 degrees celsius
Storage Tempurature Range
-65.0/+150.0 degrees celsius
Features Provided
Hermetically sealed and burn in and programmed
Inclosure Material
Ceramic
Inclosure Configuration
Dual-in-line
Output Logic Form
Complementary-metal oxide-semiconductor logic
Case Outline Source And Designator
D-3 mil-m-38510
Current Rating Per Characteristic
190.00 milliamperes reverse current, dc absolute
Terminal Surface Treatment
Solder
Voltage Rating And Type Per Characteristic
7.0 volts power source
Time Rating Per Chacteristic
100.00 nanoseconds delay
Memory Device Type
Prom
Test Data Document
96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).
Terminal Type And Quantity
24 printed circuit
NSN
5962-01-386-3200
Part Number
ROM/PROM
Description
Microcircuit,memory
CAGE
16236

A circuit designed to store information and/or coded instructions for later use. Item has pins or other connections to install in a computer or computing device. does not include magnetic drums, tapes, punched cards or the like. for items that have portable type connections see memory, portable, solid state.

Part ROM/PROM NSN 5962-01-386-3200

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
41015
FIIG:
A458A0
Concept No.:
1
App. Key:
F
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
D
ESD:
D
MMAC:
BQ
CRITL:
X

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
061045
UFC:
34580
LTL:
RATING VARIABLE
LCL:
--
WCC:
72D
TCC:
Z
SHC:
9
ACC:
Instruments/Radio

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Schedule B and Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Electronic integrated circuits and microassembly parts

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