Model: ROM/PROM

Memory Microcircuit

Properties:

Maximum Power Dissipation Rating
1.04 watts
Operating Tempurature Range
-55.0/+125.0 degrees celsius
Storage Tempurature Range
-65.0/+150.0 degrees celsius
End Application
An/fps-124
Features Provided
Programmed and schottky
Inclosure Material
Ceramic
Inclosure Configuration
Dual-in-line
Output Logic Form
Bipolar metal-oxide semiconductor
Case Outline Source And Designator
D-3 mil-m-38510
Current Rating Per Characteristic
100.00 milliamperes reverse current, dc
Terminal Surface Treatment
Solder
Part Name Assigned By Controlling Agency
Microcircuit, digital, schottky, bipolar 65, 536 bi (8k x 8) programmable read-only memory (prom) , monolithic silicon
Voltage Rating And Type Per Characteristic
-0.3 volts total supply and 7.0 volts total supply and 5.5 volts absolute input and 4.5 volts positive power supply span and 5.5 volts positive power supply span
Time Rating Per Chacteristic
55.00 nanoseconds af output megawatts
Memory Device Type
Prom
Hybrid Technology Type
Monolithic
Test Data Document
81349-mil-m-38510 specification (includes engineering type bulletins, brochures, etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type data on certain environmental and performance requirements and test conditions that are shown as "typical", "average", "", etc.). And 96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).
Terminal Type And Quantity
24 printed circuit
Specification Data
67268-82009 government standard and 56232-1219253 manufacturers specification control
Nondefinitive Specification/std Data
02 type and j case and a finish and 233 number
Departure From Cited Designator
Altered by programming, marking & testing
NSN
5962-01-369-6839
Part Number
ROM/PROM
Description
Microcircuit,memory
CAGE
16236

A circuit designed to store information and/or coded instructions for later use. Item has pins or other connections to install in a computer or computing device. does not include magnetic drums, tapes, punched cards or the like. for items that have portable type connections see memory, portable, solid state.

Part ROM/PROM NSN 5962-01-369-6839

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
41015
FIIG:
A458A0
Concept No.:
1
App. Key:
F
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
B
ESD:
B
MMAC:
EH
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
--
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
061700
UFC:
34580
LTL:
RATING VARIABLE
LCL:
77.5
WCC:
738
TCC:
Z
SHC:
9
ACC:
Instruments/Radio

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Schedule B and Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Electronic integrated circuits and microassembly parts

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