Model: RM8200N

Memory Microcircuit

Special Features:

Formed leads

Properties:

Body Length
Between 0.370 inches and 0.395 inches
Body Width
Between 0.245 inches and 0.275 inches
Body Height
Between 0.050 inches and 0.080 inches
Maximum Power Dissipation Rating
580.0 milliwatts
Operating Tempurature Range
-55.0/+125.0 degrees celsius
Storage Tempurature Range
-65.0/+200.0 degrees celsius
Features Provided
Monolithic and hermetically sealed and negative edge triggered and positive outputs
Inclosure Material
Ceramic and glass
Inclosure Configuration
Flat pack
Output Logic Form
Transistor-transistor logic
Input Circuit Pattern
Dual 6 input
Terminal Surface Treatment
Solder
Voltage Rating And Type Per Characteristic
5.5 volts power source
Time Rating Per Chacteristic
40.00 nanoseconds propagation delay time, low to high level output and 45.00 nanoseconds propagation delay time, high to low level output
Memory Device Type
Rom
Memory Capacity
Unknown
Precious Material And Location
Terminal surface gold
Precious Material
Gold
Test Data Document
94117-310131 specification (includes engineering type bulletins, brochures, etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type data on certain environmental and performance requirements and test conditions that are shown as "typical", "average", "", etc.).
Terminal Type And Quantity
24 flat leads
NSN
5962-00-530-4663
Part Number
RM8200N
Description
Microcircuit,memory
CAGE
3B150

A circuit designed to store information and/or coded instructions for later use. Item has pins or other connections to install in a computer or computing device. does not include magnetic drums, tapes, punched cards or the like. for items that have portable type connections see memory, portable, solid state.

Part RM8200N NSN 5962-00-530-4663

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
41015
FIIG:
A458A0
Concept No.:
1
App. Key:
F
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
G
ESD:
B
ESD:
B
MMAC:
EH
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
0.1000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
061700
UFC:
34580
LTL:
RATING VARIABLE
LCL:
77.5
WCC:
738
TCC:
Z
SHC:
9
ACC:
Instruments/Radio

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Schedule B and Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Electronic integrated circuits and microassembly parts

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