Special Features:

Plate has a cutout in the center that allows room for welding, while dissipating heat from adjacent louver

Properties:

An item for dissipating heat during soldering operations which incorporates either a liquid absorbent in the form of foam or gel, or a metallic absorbent. The metallic absorbent is designed for attachment to heat sensitive components, such as diodes or transistors, to prevent thermal changes. Excludes heat sink, electrical-electronic components.