Model: PALC22V10-30LMB

Memory Microcircuit

Properties:

Body Length
1.280 inches
Body Width
0.310 inches
Body Height
0.200 inches
Maximum Power Dissipation Rating
1.2 watts
Operating Tempurature Range
-55.0/+125.0 degrees celsius
Storage Tempurature Range
-65.0/+150.0 degrees celsius
Features Provided
Programmable
Inclosure Configuration
Leadless flat pack
Output Logic Form
Complementary-metal oxide-semiconductor logic
Current Rating Per Characteristic
16.00 milliamperes forward current, nonrepetitive, peak total value
Terminal Surface Treatment
Solder
Voltage Rating And Type Per Characteristic
7.0 volts total supply
Memory Device Type
Pal
Terminal Type And Quantity
28 leadless
NSN
5962-01-382-7821
Part Number
PALC22V10-30LMB
Description
Microcircuit,memory
CAGE
65786

A circuit designed to store information and/or coded instructions for later use. Item has pins or other connections to install in a computer or computing device. does not include magnetic drums, tapes, punched cards or the like. for items that have portable type connections see memory, portable, solid state.

Part PALC22V10-30LMB NSN 5962-01-382-7821

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
41015
FIIG:
A458A0
Concept No.:
1
App. Key:
F
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
D
ESD:
D
MMAC:
EH
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
0.1000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
061700
UFC:
34580
LTL:
RATING VARIABLE
LCL:
77.5
WCC:
738
TCC:
Z
SHC:
9
ACC:
Instruments/Radio

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Schedule B and Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Electronic integrated circuits and microassembly parts

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