Model: PAL16H2

Memory Microcircuit

Properties:

Body Length
0.358 inches
Body Width
0.358 inches
Body Height
0.100 inches
Maximum Power Dissipation Rating
2.0 watts
Operating Tempurature Range
-55.0/+125.0 degrees celsius
Storage Tempurature Range
-65.0/+150.0 degrees celsius
Features Provided
Hermetically sealed and burn in and bipolar and monolithic
Inclosure Material
Ceramic
Inclosure Configuration
Leadless flat pack
Output Logic Form
Transistor-transistor logic
Input Circuit Pattern
16 input
Case Outline Source And Designator
C-2 mil-m-38510
Terminal Surface Treatment
Solder
Voltage Rating And Type Per Characteristic
7.0 volts power source
Time Rating Per Chacteristic
45.00 nanoseconds delay
Memory Device Type
Pal
Test Data Document
96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).
Terminal Type And Quantity
20 leadless
NSN
5962-01-263-0992
Part Number
PAL16H2
Description
Microcircuit,memory
CAGE
50364

A circuit designed to store information and/or coded instructions for later use. Item has pins or other connections to install in a computer or computing device. does not include magnetic drums, tapes, punched cards or the like. for items that have portable type connections see memory, portable, solid state.

Part PAL16H2 NSN 5962-01-263-0992

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
41015
FIIG:
A458A0
Concept No.:
1
App. Key:
F
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
B
ESD:
B
MMAC:
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
--
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
SPI Rev.:
SPC Mkg:
39
LVL_A:
Q
LVL_B:
Q

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Schedule B and Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Electronic integrated circuits and microassembly parts

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