Special Features:

Intel lga 1366 platform, x58 chipset; triple-channel ddr3 2000 (o.C.), 1866 (o.C.), 1800 (o.C.), 1600 (o.C.), 1333, 1066 memory; true 16+2 phase power design; turbov, new oc records with real time super precise tunings; epu system level energy saving; express gate ssd, 0 to internet in seconds; sli and crosfirex on demand

Properties:

An insulating panel upon which two or more connector, receptacle, electrical, are mounted, and completely processed electrical conductor paths are deposited, etched, or printed in various paths. it provides or completes a circuit between two or more circuit card assembly or electronic components assembly. it may be designed for panel or chassis mounting, or for insertion into a connector, receptacle, electrical. includes motherboards. for items containing processed electrical conductor paths and contacts for plug-in connecting facilities, see printed wiring board. see also printed circuit board; circuit card assembly and cable assembly, printed, flexible.