Model: MSP-30

Semiconductor Device Set

Properties:

Inclosure Material
Metal all transistor
Overall Length
1.003 inches all transistor
Overall Height
0.330 inches all transistor
Overall Width
0.505 inches all transistor
Mounting Facility Quantity
2 all transistor
Internal Configuration
Junction contact all transistor
Electrode Internally-electrically Connected To Case
Collector all transistor
Internal Junction Configuration
Npn all transistor
Component Function Relationship
Matched
Component Name And Quantity
2 transistor
Mounting Method
Unthreaded hole all transistor
Semiconductor Material
Silicon all transistor
Voltage Rating In Volts Per Characteristic
300.0 breakdown voltage, collector-to-base, emitter open all transistor and 300.0 breakdown voltage, collector-to-emitter, with specified resistance between base and emitter all transistor and 5.0 breakdown voltage, emitter-to-base, collector open all transistor
Current Rating Per Characteristic
3.00 microamperes zero-gate-voltage source current preset all transistor
Power Rating Per Characteristic
5.0 watts small-signal input power, common-collector preset all transistor
Maximum Operating Tempurature Per Measurement Point
200.0 degrees celsius junction all transistor
Precious Material And Location
Terminal surfaces gold
Precious Material
Gold
Test Data Document
00752-334761 drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing)
Terminal Type And Quantity
3 uninsulated wire lead all transistor and 1 case all transistor
NSN
5961-00-415-2017
Part Number
MSP-30
Description
Semiconductor Device Set
CAGE
07256

A grouping of two or more individual semiconductor devices, such as transistors, diodes, and photo semiconductor devices. It includes matched pairs. Excludes absorber, overvoltage; semiconductor device assembly. For interconnected items functioning as power supply rectifiers, see rectifier, semiconductor device.

Part MSP-30 NSN 5961-00-415-2017

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
20590
FIIG:
A110A0
Concept No.:
App. Key:
F
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
G
ESD:
A
ESD:
A
MMAC:
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
0.1000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
O
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
063025
UFC:
34525
LTL:
RATING VARIABLE
LCL:
--
WCC:
658
TCC:
Z
SHC:
9
ACC:
Instruments/Radio

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Schedule B and Export
  • Schedule B: 8541500080
  • SITC: 77639
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Semiconductor devices, nesoi

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