Model: MIS-22876/2609

Memory Microcircuit

Properties:

Body Length
0.840 inches
Body Width
Between 0.220 inches and 0.310 inches
Body Height
0.185 inches
Maximum Power Dissipation Rating
715.0 milliwatts
Operating Tempurature Range
-55.0/+125.0 degrees celsius
Storage Tempurature Range
-65.0/+150.0 degrees celsius
Features Provided
Monolithic and hermetically sealed and schottky and programmable and bipolar and 3-state output and w/active pull-up
Inclosure Material
Ceramic and glass
Inclosure Configuration
Flat pack
Output Logic Form
Transistor-diode-resistor logic
Input Circuit Pattern
10 input
Case Outline Source And Designator
F-5 mil-m-38510
Time Rating Per Chacteristic
75.00 nanoseconds propagation delay time, low to high level output and 75.00 nanoseconds propagation delay time, high to low level output
Memory Device Type
Prom
NSN
5962-01-206-5866
Part Number
MIS-22876/2609
Description
Microcircuit,memory
CAGE
19605

A circuit designed to store information and/or coded instructions for later use. Item has pins or other connections to install in a computer or computing device. does not include magnetic drums, tapes, punched cards or the like. for items that have portable type connections see memory, portable, solid state.

Part MIS-22876/2609 NSN 5962-01-206-5866

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
41015
FIIG:
A458A0
Concept No.:
1
App. Key:
F
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
A
ESD:
A
MMAC:
CRITL:
X

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
063025
UFC:
34525
LTL:
RATING VARIABLE
LCL:
RATING VARIABLE
WCC:
658
TCC:
Z
SHC:
9
ACC:
Equipment for Aircraft

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Schedule B and Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Electronic integrated circuits and microassembly parts

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