Model: MBD-X8DAE-O

Backplane Assembly

Special Features:

Dim: 12" x 13"; 12x240 pin dimm sockets; op temp: 10 degrees to 35 degrees c; ps/2 keyboard and mouse ports

Properties:

Part Name Assigned By Controlling Agency
Motherboard
NSN
5998-01-590-5218
Part Number
MBD-X8DAE-O
Description
Backplane Assembly
CAGE
3VMS9

An insulating panel upon which two or more connector, receptacle, electrical, are mounted, and completely processed electrical conductor paths are deposited, etched, or printed in various paths. it provides or completes a circuit between two or more circuit card assembly or electronic components assembly. it may be designed for panel or chassis mounting, or for insertion into a connector, receptacle, electrical. includes motherboards. for items containing processed electrical conductor paths and contacts for plug-in connecting facilities, see printed wiring board. see also printed circuit board; circuit card assembly and cable assembly, printed, flexible.

Part MBD-X8DAE-O NSN 5998-01-590-5218

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
34736
FIIG:
A511K0
Concept No.:
App. Key:
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
A
ESD:
A
MMAC:
CRITL:
X

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Schedule B and Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Electronic integrated circuits and microassembly parts

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