Model: MBD-X7DCL-3-0
Backplane AssemblySpecial Features:
Intel 5100 (san clemete) chipset; up to 48gb 667/533mhz ddr2 ecc register sdram; intel 82573v and 82573l gigabit ethernet controller; lsi 1068e 8-port sas controller; 6x sata (3 gbps) ports via ich9r sb controller; 2 (x8) pci-e, 1 (x4) pci-e (using x8 slot), 3x 32-bit pci slots; xgi z9 graphics with 32mb video memory; low profile ipmi 2.0 (simlc) slot
Properties:
An insulating panel upon which two or more connector, receptacle, electrical, are mounted, and completely processed electrical conductor paths are deposited, etched, or printed in various paths. it provides or completes a circuit between two or more circuit card assembly or electronic components assembly. it may be designed for panel or chassis mounting, or for insertion into a connector, receptacle, electrical. includes motherboards. for items containing processed electrical conductor paths and contacts for plug-in connecting facilities, see printed wiring board. see also printed circuit board; circuit card assembly and cable assembly, printed, flexible.
Part MBD-X7DCL-3-0 NSN 5998-01-580-7456
Material Classification
Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicatorsFreight Classification
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Schedule B and Export
- Schedule B: 8542900000
- SITC: 77689
- End Use: Semiconductors
- NAICS: 334413
- USDA: 1
Freight Class: Electronic integrated circuits and microassembly parts
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