Model: MA8334-057

Unitized Semiconductor Devices

Special Features:

Common anode pin diode switch

Properties:

Overall Length
Between 0.970 inches and 0.980 inches
Terminal Length
0.350 inches
Overall Height
0.290 inches
Overall Width
0.505 inches
Mounting Facility Quantity
2
Response Time
700.0 nanoseconds all semiconductor device diode
Component Name And Quantity
3 semiconductor device diode
Mounting Method
Unthreaded hole
Voltage Rating In Volts Per Characteristic
400.0 breakdown voltage, dc all semiconductor device diode and 1.2 forward voltage, dc all semiconductor device diode
Maximum Operating Tempurature Per Measurement Point
125.0 degrees celsius ambient air
Precious Material And Location
Plated leads gold
Precious Material
Gold
Test Data Document
80063-a3012735 drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing)
Terminal Type And Quantity
4 ribbon
NSN
5961-01-298-5011
Part Number
MA8334-057
Description
Semiconductor Devices,unitized
CAGE
96341

Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see rectifier, semiconductor device. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see microcircuit (as modified). Excludes network (as modified); absorber, overvoltage; semiconductor device set; and semiconductor device assembly. Do not use if more specific name applies.

Part MA8334-057 NSN 5961-01-298-5011

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
61962
FIIG:
A110A0
Concept No.:
App. Key:
E
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
G
ESD:
A
ESD:
A
MMAC:
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
0.1000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
O
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
063025
UFC:
34525
LTL:
RATING VARIABLE
LCL:
RATING VARIABLE
WCC:
72D
TCC:
Z
SHC:
9
ACC:
Instruments/Radio

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Schedule B and Export
  • Schedule B: 8541500080
  • SITC: 77639
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Semiconductor devices, nesoi

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