Special Features:

Isolated package; high voltage isolation=2.5 kvrms; sink to lead creepage dist=4.8mm; dynamic dv/dt rating; low thermal resistance; lead free; the to-220 fullpak eliminates the need for additional insulating hardware in commercial-industrial applications; the moulding compound used provides a high isolation capability and a low themal resistance between the tap and externa heatsink; this isolation is equivalent to using a 100 micron mica barrier with standard to-220 product the fullpak is mounted to a heatsink using a single clip or by a single screw fixing

Properties:

An active semiconductor device with three or more electrodes. May or may not include mounting hardware and/or heatsink. Excludes semiconductor device, diode and semiconductor device, thyristor. For solid state devices which are responsive to visible or infrared radiant energy, see semiconductor device, photo.