Model: HYSOL FP6101

Adhesive

Special Features:

Premixed and frozen; unfilled; flexible; removable; elevated temperature cure, 5 to 10 minutes at 150 degrees c; must be shipped and stored at minus 40 degrees c or below

Properties:

Physical Form
Paste
Quantity Within Each Unit Package
10.000 milliliters
Specific Usage Design
For underfilling chip scale packages (csps) and ball grid arrays (bgas) on circuit boards
Curing Method
Heat
Features Provided
Separate catalyst
Color
Black
Material
Plastic epoxy
Supplementary Features
10 milliliter syringe
NSN
8040-01-603-7992
Part Number
HYSOL FP6101
Description
Adhesive
CAGE
04347

Part HYSOL FP6101 NSN 8040-01-603-7992

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
11297
FIIG:
A535P0
Concept No.:
App. Key:
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
D
PMIC:
A
ESD:
ESD:
MMAC:
CRITL:
X

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
004620
UFC:
02480
LTL:
RATING VARIABLE
LCL:
--
WCC:
705
TCC:
Z
SHC:
9
ACC:
Chemicals

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