Model: H40

Adhesive

Properties:

Physical Form
Paste
Specific Usage Design
Bonding semiconductor chips in the fabrication of hybrid circuits; die attaching mos chips
NSN
8040-01-145-1053
Part Number
H40
Description
Adhesive
CAGE
33246

Part H40 NSN 8040-01-145-1053

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
11297
FIIG:
A535P0
Concept No.:
App. Key:
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
D
PMIC:
U
ESD:
ESD:
MMAC:
CRITL:
X

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