Model: GM812D5

Semiconductor Device Assembly

Properties:

Overall Length
Between 0.845 inches and 0.855 inches
Overall Height
Between 0.842 inches and 0.847 inches
Overall Width
Between 0.385 inches and 0.395 inches
Major Components
Diode 2, pin contact 4, sealing plug 2, retaining clip 1, module housing 1, contact socket 1
End Application
Joint stars airframe
Part Name Assigned By Controlling Agency
Module feed-back assembly, size 20tj with two jantx1n5618 diodes
NSN
5961-01-511-0060
Part Number
GM812D5
Description
Semiconductor Device Assembly
CAGE

A grouping of two or more semiconducting devices such as light emitting diode; semiconductor device, diode; semiconductor device, photo; semiconductor device, thyristor; and/or transistor mounted on a common mounting or mounted on each other. The devices must be separable and each item must be capable of functioning in accordance with its given name. For assemblies consisting of semiconducting devices permanently cased, encapsulated, or potted together to form a single unit, see rectifier, semiconductor device, unitized and semiconductor devices, unitized. Excludes semiconductor device set; microcircuit assembly; and microcircuit set. See also absorber, overvoltage.

Part GM812D5 NSN 5961-01-511-0060

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
35565
FIIG:
T01200
Concept No.:
App. Key:
C
Cond. Code:
2
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
B
ESD:
B
MMAC:
WH
CRITL:
X

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Schedule B and Export
  • Schedule B: 8541500080
  • SITC: 77639
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Semiconductor devices, nesoi

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