Model: CUPOSIT ACCELERATOR 19

Electroless Plating Solution Add

Properties:

Functional Description
Used to promote copper to copper adhesion on printed circuit boards
General Description
Liquid concentrate
Reference Number Differentiating Characteristics
5 gallon drum
NSN
6850-01-183-4635
Part Number
CUPOSIT ACCELERATOR 19
Description
Electroless Plating Solution Add
CAGE
21079

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
Y
PMIC:
A
ESD:
ESD:
MMAC:
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
--
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
E
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
043940
UFC:
23310
LTL:
RATING VARIABLE
LCL:
--
WCC:
635
TCC:
W
SHC:
9
ACC:
Chemicals

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