Model: CUPOSIT ACCELERATOR 19

Electroless Plating Solution Add

Properties:

Functional Description

Used to promote copper to copper adhesion on printed circuit boards

General Description

Liquid concentrate

Reference Number Differentiating Characteristics

5 gallon drum

NSN

6850-01-183-4635

Part Number

CUPOSIT ACCELERATOR 19

Description

Electroless Plating Solution Add

CAGE

21079

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators

HMIC

PMIC

ESD/EMI

ENAC

MMAC

CRITL

HMIC:

PMIC:

ESD:

MMAC:

CRITL:

Packaging & Shipping

Est. Pack Size

Est. Pack Weight

Est. Item Weight

Est. Item Dim.

Pack Size:

Paclk Weight:

Item Weight:

Item Dim:

OPI

SPI No.

SPI Rev.

SPC Mkg.

LVL A

LVL B

OPI:

SPI No.:

SPI Rev.:

SPC Mkg:

LVL_A:

LVL_B:

Freight Classification

NMFC

UFC

LTL

LCL

WCC

TCC

SHC

ACC

NMFC:

043940

UFC:

23310

LTL:

RATING VARIABLE

LCL:

WCC:

635

TCC:

SHC:

ACC:

Chemicals

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