Model: CHO-BOND 1038
Sealing CompoundSpecial Features:
Silver-plated copper filler
Properties:
A chemical composition formulated for coating or for filling voids, cracks, joints or seams of objects and/or materials to exclude foreign matter and/or prevent the transmission of fluids therethrough. It is not designed to act as a primer coating or to be sanded or ground after application. It cannot be wiped off. For items which are specifically compounded to provide electrical insulating characteristics, use insulating compound, electrical. Excludes caulking compound; gasket cement; corrosion preventive compound; cement, iron and steel; plumbing fixture setting compound; preservative coating, rubber and textile treating compounds.
Part CHO-BOND 1038 NSN 8030-01-208-9494
Material Classification
Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicatorsPackaging & Shipping
Freight Classification
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Schedule B and Export
- Schedule B: 3214100010
- SITC: 53354
- End Use: Shingles, molding, wallboard
- NAICS: 325520
- USDA: 1
Freight Class: Caulking compounds
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