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- CHO-BOND 360-208
Model: CHO-BOND 360-208
AdhesiveSpecial Features:
Pure silver and silver plated copper filler blend; for fillet sealing applications; service temperature range of minus 80 degrees f to plus 212 degrees f
Properties:
Part CHO-BOND 360-208 NSN 8040-01-224-2335
Material Classification
Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicatorsPackaging & Shipping
Freight Classification
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