Model: BOXD946GZISSL
Backplane AssemblySpecial Features:
Memory two 240-pin ddr2 sdram dual inline memory module (dimm) sockets; support for ddr2 667 or ddr2 533 mhz dimms; support for up to 4 gb of systemmemory; usb supports 2.0 devices; lan support, 10/100 mbits/sec lan subsystem using the intel 82562g platform lan connect (plc) device; supports for up to 4 gb of system memory; audio, 6-channel (5.1) audio subsystem using the sigma tel stac9227 audio codec;
Properties:
An insulating panel upon which two or more connector, receptacle, electrical, are mounted, and completely processed electrical conductor paths are deposited, etched, or printed in various paths. it provides or completes a circuit between two or more circuit card assembly or electronic components assembly. it may be designed for panel or chassis mounting, or for insertion into a connector, receptacle, electrical. includes motherboards. for items containing processed electrical conductor paths and contacts for plug-in connecting facilities, see printed wiring board. see also printed circuit board; circuit card assembly and cable assembly, printed, flexible.
Part BOXD946GZISSL NSN 5998-01-560-6762
Material Classification
Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicatorsPricing & Availability Check
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Schedule B and Export
- Schedule B: 8542900000
- SITC: 77689
- End Use: Semiconductors
- NAICS: 334413
- USDA: 1
Freight Class: Electronic integrated circuits and microassembly parts
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