Model: AX309-78
Backplane AssemblySpecial Features:
Mtg plate material glass epoxy per mil-p-18177; contact outer sleeve material brass per qq-b-626 or phosphor bronze per qq-b-750; inner contact material beryllium copper per qq-c-530; finish gold per mil-g-45204 over nickel per qq-n-290; contact current rating 3.0 amps; 6.750 in. Lg.; 4.000 in. W.; (10) holes 0.125 in. Dia.; (6) holes 0.150 in. Dia.; precious material and weight: gold, 0.005 troy grains
Properties:
An insulating panel upon which two or more connector, receptacle, electrical, are mounted, and completely processed electrical conductor paths are deposited, etched, or printed in various paths. it provides or completes a circuit between two or more circuit card assembly or electronic components assembly. it may be designed for panel or chassis mounting, or for insertion into a connector, receptacle, electrical. includes motherboards. for items containing processed electrical conductor paths and contacts for plug-in connecting facilities, see printed wiring board. see also printed circuit board; circuit card assembly and cable assembly, printed, flexible.
Part AX309-78 NSN 5998-01-142-5103
Material Classification
Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicatorsPackaging & Shipping
Freight Classification
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Schedule B and Export
- Schedule B: 8542900000
- SITC: 77689
- End Use: Semiconductors
- NAICS: 334413
- USDA: 1
Freight Class: Electronic integrated circuits and microassembly parts
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