Model: 8555188-2

Linear Microcircuit

Properties:

Body Outside Diameter
Between 0.335 inches and 0.370 inches
Body Height
Between 0.165 inches and 0.185 inches
Maximum Power Dissipation Rating
500.0 milliwatts
Operating Tempurature Range
+0.0/+70.0 degrees celsius
Storage Tempurature Range
-65.0/+150.0 degrees celsius
Features Provided
Hermetically sealed and monolithic and negative outputs and positive outputs and high speed
Inclosure Material
Glass and metal
Inclosure Configuration
Can
Input Circuit Pattern
2 input
Design Function And Quantity
1 comparator, voltage, differential
Case Outline Source And Designator
T0-99 joint electron device engineering council
Terminal Surface Treatment
Solder
Time Rating Per Chacteristic
40.00 nanoseconds propagation delay time, low to high level output and 40.00 nanoseconds propagation delay time, high to low level output
Test Data Document
11447-8555188 drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing)
NSN
5962-00-243-2074
Part Number
8555188-2
Description
Microcircuit,linear
CAGE
11447

A microcircuit whose output is a function of the input; that is, the output varies in a predetermined and essentially predictable manner from the input signal.

Part 8555188-2 NSN 5962-00-243-2074

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
31778
FIIG:
A458A0
Concept No.:
1
App. Key:
B
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
B
ESD:
B
MMAC:
CRITL:
X

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
061700
UFC:
34580
LTL:
RATING VARIABLE
LCL:
--
WCC:
658
TCC:
Z
SHC:
5
ACC:
Instruments/Radio

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Schedule B and Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Electronic integrated circuits and microassembly parts

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