Model: 72B039023-1001

Di Semiconductor Device Assembly

Special Features:

Six zener diodes mtd between 2 boards; 2.000 in., 1.500 in., 0.480 in. O/a assembly dim.

Properties:

General Description
Six zener diodes mtd between 2 boards; 2.000 in., 1.500 in., 0.480 in. O/a assembly dim.
NSN
5961-01-069-5512
Part Number
72B039023-1001
Description
Semiconductor Device Assembly,di
CAGE
76301

Inc 61801 cancelled/replaced by ,inc 35565, fiig t01200, app-key c ,on 100112 ~(all except usa) this previously deleted inc has been reinstated for file maintenance only.

Part 72B039023-1001 NSN 5961-01-069-5512

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
61801
FIIG:
A23900
Concept No.:
App. Key:
A
Cond. Code:
1
Status:
C

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
D
ESD:
D
MMAC:
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
3.0 X 3.0 X 2.0
Paclk Weight:
0.1000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
SPI Rev.:
SPC Mkg:
00
LVL_A:
E
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
063025
UFC:
34525
LTL:
RATING VARIABLE
LCL:
100.0
WCC:
658
TCC:
Z
SHC:
9
ACC:
Instruments/Radio

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Schedule B and Export
  • Schedule B: 8541500080
  • SITC: 77639
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Semiconductor devices, nesoi

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